Cross-design team interconnect planning

February 28th, 2012, Published in Articles: EngineerIT

by John Park, Mentor Graphics, USA

Interconnect and I/O planning between the design teams for IC layout, package substrate design, and printed circuit board (PCB) layout is critical to driving down costs for the package and the PCB.

Please download pdf

Related Articles

  • Quantum computing is important for Africa
  • Disparate radio systems threaten public safety
  • The cloud is still “cloudy”
  • Helping consumer monitor and manage water consumption
  • Gadgets4Geeks – June 2019