Bus converter modules enable high voltage DC distribution

February 27th, 2014, Published in Articles: EngineerIT

 

New 380 V DC input ChiP bus converter modules enable high voltage DC distribution with 98% efficient conversion to 48 V at 115 W/cm3 power density. Vicor Corporation recently unveiled the first module utilising its converter housed in package (ChiP) power component platform.

ecs-142-03-2014The new ChiP bus converter modules (BCM) supply 1,2 kW at 48 V with 98% peak efficiency and 115 W/cm3 power density. It is said that breakthrough performance – four times the density of competing solutions – enables efficient, high voltage DC distribution infrastructure in data centres, telecoms, and industrial applications. The corporation’s ChiP platform sets standards for a new generation of scalable power modules. Leveraging advanced magnetic structures integrated within high density interconnect (HDI) substrates with power semiconductors and control ASICs, ChiPs provide superior thermal management supporting unprecedented power density. Thermally adept ChiPs enable customers to achieve low cost power system solutions with previously unattainable system size, weight and efficiency attributes, quickly and predictably.

Contact Leean Ball, ECS South Africa, Tel 012 345-6132, leean@ecssa.co.za

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