WLAN front-end module for high data-rate mobile device applications

February 27th, 2014, Published in Articles: EngineerIT


tempe-tech-147-03-2014Microchip has announced its new 5 GHz, 50 Ω matched WLAN front-end module (FEM), the SST11LF04, for high data-rate mobile device applications. The SST11LF04 features a transmitter power amplifier, a receiver low-noise amplifier with bypass, and a low-loss, single-pole two-throw antenna switch for 5 GHz WLAN connectivity in one integrated, compact 2,5 x 2,5 x 0,4 mm, 16-pin QFN package, making it ideal for high-data-rate mobile device applications. With its small footprint, high linear output power of up to 16 dBm and 17 dBm, at 3,3 V and 5 V Vcc respectively – for 1,75% dynamic EVM using MCS9-HT80 modulation and 80 MHz bandwidth along with 18 dBm and 19 dBm linear power for 3% EVM at 3,3 V and 5 V, respectively – the SST11LF04 extends the range of IEEE 802.11a WLAN systems while providing exceptional transmit power at the maximum 11 ACc high-data-rate modulation. The receiver has a 12 dB gain and a greater than -6 dBm input (1 dB) compression level. In LNA bypass mode, the receiver has a 2,5 dB noise figure and a -6 dBm input compression level.

Contact Willem Hijbeek, Tempe Technologies, Tel 011 455-5587, willem.hijbeek@tempetech.co.za

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